From Readiness to Payoff: Linking Organizational Readiness, Adoption Maturity, and Benefits in Digital Engineering

Authors

• Rui Sundrup, University of LouisvilleFollow
• Yuchun Zhou, Ohio UniversityFollow
• Yuqiu You, Ohio UniversityFollow

Recommended Citation

Sundrup, Rui; Zhou, Yuchun; and You, Yuqiu, "From Readiness to Payoff: Linking Organizational Readiness, Adoption Maturity, and Benefits in Digital Engineering" (2026). MWAIS 2026 Proceedings. 60.
https://aisel.aisnet.org/mwais2026/60