Process Chart for Controlling Wafer Defects using Fuzzy Theory

Authors

Leeing Tong, Department of Industrial Engineering and Management, National Chiao Tung University, Hsinchu, TaiwanFollow
Chienhui Yang, Department of Industrial Engineering and Management, National Chiao Tung University, Hsinchu, TaiwanFollow
Min-Hsiang Chen, Department of Industrial Engineering and Management, National Chiao Tung University, Hsinchu, TaiwanFollow
Hsiang-Pai Yu, Department of Industrial Engineering and Management, National Chiao Tung University, Hsinchu, TaiwanFollow
Min-Chia Wang, Department of Industrial Engineering and Management, National Chiao Tung University, Hsinchu, Taiwan

Document Type

Article

Abstract

Manufacturers of integrated circuits (IC) frequently utilize c-charts to monitor wafer defects. The clustering of wafer defects increases with the surface area of the wafers. The clustering of defects causes the Poisson-based c-chart to show many false alarms. Although Neyman-based c-chart has been developed to reduce the number of false alarms, it has some shortcomings in practical use. This study presents a process control chart that applies Fuzzy theory and the engineering experience to monitor the clustered defects on a wafer. The proposed method is simpler and more efficient than that of the Neyman-based c-chart. A case study of an IC company in Taiwan demonstrates the effectiveness of the proposed method.

Recommended Citation

Tong, Leeing; Yang, Chienhui; Chen, Min-Hsiang; Yu, Hsiang-Pai; and Wang, Min-Chia, "Process Chart for Controlling Wafer Defects using Fuzzy Theory" (2003). ICEB 2003 Proceedings (Singapore). 146.
https://aisel.aisnet.org/iceb2003/146